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rev. 1.1 july 2011 www.aosmd.com page 1 of 13 AOZ1312 single channel usb switch general description the AOZ1312 is a member of alpha and omega semiconductor?s single-channel power-distribution switch family intended for applications where heavy capacitive loads and short-circuits are likely to be encountered. this device incorporates a 70 m ? n-channel mosfet power switch for power-distribution systems. the switch is controlled by a logic enable input. gate drive is provided by an internal charge pump designed to control the power-switch rise time and fall time to minimize current surges during switching. the charge pump requires no external components and allows operation from supplies as low as 2.7 v. the AOZ1312 is available in an so-8 or emsop-8 package and is rated over the -40 c to +85 c ambient temperature range. features z typical 70 m ? (nfet) z 1.5a maximum continuous current z vin range of 2.7 v to 5.5 v z open drain fault flag z fault flag deglitched (blanking time) z thermal shutdown z reverse current blocking z packages: so-8 and emsop-8 applications z notebook computers z desktop computers typical application AOZ1312 in oc en out gnd v in c2 0.1 f cin c1 22 f load r1 10k
AOZ1312 rev. 1.1 july 2011 www.aosmd.com page 2 of 13 ordering information *contact factory for availability aos green products use reduced levels of halogens, and are also rohs compliant. please visit www.aosmd.com/web/quality/rohs_compliant.jsp for additional information. pin configuration pin description part number maximum continuous current typical short-circuit current limit enable setting package output discharge environmental channel 1 channel 2 channel 1 channel 2 aoz1341ai 1 a 1a 1.5 a 1.5 a active low so-8 no green product rohs compliant aoz1341ei epad msop-8 aoz1341ai-1 active high so-8 aoz1341ei-1 epad msop-8 aoz1342pi 1.5 a 1.5a 2 a 2 a active low epad so-8 aoz1342pi-1 active high epad so-8 aoz1343ai* 1.5 a 0.5a 2 a 0.75 a active low so-8 aoz1343ei* epad msop-8 aoz1343ai-1* active high so-8 aoz1343ei-1* epad msop-8 AOZ1312ai-1 1.5 a none 2 a none active high so-8 AOZ1312ei-1 epad msop-8 aoz1310ci-1 0.5 a none 0.75 a none active high sot23-5 pin name pin number pin function gnd 1 ground in 2, 3 input voltage en 4 enable input, logic high turns on power switch, in-out oc 5 overcurrent, open-drain output, active low, in-out out 6, 7 power-switch output, in-out nc 8 no connection nc out out oc 1 2 3 4 gnd in in en emsop-8 / so-8 (top view) 8 7 6 5 AOZ1312
AOZ1312 rev. 1.1 july 2011 www.aosmd.com page 3 of 13 absolute maximum ratings exceeding the absolute maximum ratings may damage the device. note: 1. devices are inherently esd s ensitive, handling precautions are required. human body model is a 100 pf capacitor discharging through a 1.5 k resistor. recommended operating conditions the device is not guaranteed to operate beyond the recommended operating conditions. parameter rating input voltage (v in )6 v enable voltage (v en )6 v storage temperature (t s ) -55 c to +150 c esd rating (1) 2 kv parameter rating input voltage (v in ) +2.7 v to +5.5 v junction temperature (t j ) -40 c to +125 c package thermal resistance ( ja ) emsop-8 so-8 60 c/w 115 c/w electrical characteristics t a = 25 c, v in = v en =5.5 v, unless otherwise specified. symbol parameter conditions (3) min. typ. max. units power switch r ds(on) switch on-resistance v in = 5.5 v, i out = 1.5 a 70 135 m t r rise time, output v in = 5.5 v, c l = 1 f, r l = 5 0.6 1.5 ms v in = 2.7 v, c l = 1 f, r l = 5 0.4 1 t f fall time, output v in = 5.5 v 0.05 0.5 ms v in = 2.7 v 0.05 0.5 fet leakage current out connect to ground, v i(enx) = 5.5 v, or v i(enx) = 0 v -40 c t j 125 c (2) 1 a enable input en v ih high-level input voltage 2.7v v in 5.5v 2.0 v v il low-level input voltage 2.7v v in 5.5v 0.8 v i i input current -0.5 -0.5 a t on turn-on time c l = 100 f, r l = 5 3ms t off turn-off time c l = 100 f, r l = 5 10 current limit i os short-circuit output current 1.5 2.0 2.5 a i oc_trip overcurrent trip threshold 1.6 2.3 2.7 a supply current supply current, low-level output no load on out, v i(enx) = 5.5 v, or v i(enx) = 0 v t j = 25c 0.5 1 a -40 c t j 125 c (2) 0.5 5 supply current, high-level output no load on out, v i(enx) = 0 v, or v i(enx) = 5.5 v t j = 25c 50 70 a -40 c t j 125 c (2) 50 90 reverse leakage current v i(outx) = 5.5v, in = ground t j = 25 c 0.2 a
AOZ1312 rev. 1.1 july 2011 www.aosmd.com page 4 of 13 note: 2. parameters are guaranteed by design only and not production tested. 3. pulse testing techniques maintain juncti on temperature close to ambient temperature; thermal effects must be taken into acco unt separately. functional block diagram undervoltage lockout low-level voltage, in 2 2.5 v hysteresis, in t j = 25c 200 mv overcurrent oc output low voltage v ol(ocx) i o(ocx) = 5ma 0.4 v off-state current v o(ocx) = 5v or 3.3v 1 a oc_l deglitch ocx assertion or deassertion 4 8 15 ms thermal shutdown thermal shutdown threshold 135 c recovery from thermal shutdown 105 c hysteresis 30 c electrical characteristics (continued) t a = 25 c, v in = v en =5.5 v, unless otherwise specified. symbol parameter conditions (3) min. typ. max. units deglitch in en oc out thermal shutdown gate driver AOZ1312 current limit uvlo comparator 2.5v
AOZ1312 rev. 1.1 july 2011 www.aosmd.com page 5 of 13 functional characteristics figure 1. turn-on delay and rise time with 1 f load (active high) figure 2. turn-off delay and fall time with 1 f load (active high) figure 3. turn-on delay and rise time with 100 f load (active high) figure 4. turn-off delay and fall time with 100 f load (active high) figure 5. short-circuit current, device enable to short (active high) figure 6. 0.6 load connected to enable to device (active high) en 5v/div vout 2v/div en 5v/div vout 2v/div en 2v/div iout 1a/div oc 2v/div iout 1a/div en 5v/div vout 2v/div en 5v/div vout 2v/div 200 s/div 200 s/div 200 s/div 500 s/div 200 s/div 2ms/div r l = 5 c l = 1 f t a = 25c r l = 5 c l = 1 f t a = 25c r l = 5 c l = 100 f t a = 25c r l = 5 c l = 100 f t a = 25c
AOZ1312 rev. 1.1 july 2011 www.aosmd.com page 6 of 13 functional characteristics (continued) typical characteristics figure 7. inrush current with different load capacitance figure 8. short circuit current limit en 5v/div en 2v/div iout 500ma/div 1ms/div 20ms/div iout 500ma/div 100f 470f 220f v in = 5v r l = 5 t a = 25c junction temperature ( c) -50 0 50 100 150 figure 9. supply current, output enabled vs. junction temperature 70 60 50 40 30 20 10 0 junction temperature ( c) supply current ( a) vin=2.7v vin=3.3v vin=5v vin=5.5v figure 10. supply current, output disabled vs. junction temperature 0 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 junction temperature (c) supply current ( a) figure 11. rds(on) vs. ambient temperature 200 180 160 140 120 100 80 60 40 20 0 vin=2.7v vin=3.3v vin=5v vin=5.5v figure 12. uvlo threshold vs. junction temperature 2.22 2.21 2.20 2.19 2.18 2.17 2.16 2.15 2.14 2.13 2.12 2.11 junction temperature (c) threshold (v) rising falling -50 0 50 100 150 -50 0 50 100 150 -50 0 50 100 150 vin=2.7v vin=3.3v vin=5v vin=5.5v rdson (m)
AOZ1312 rev. 1.1 july 2011 www.aosmd.com page 7 of 13 detailed description the AOZ1312 is a member of alpha and omega semiconductor?s single-channel power-distribution switches family. the ao z1312 is intended for applications where heavy capacitive loads and short-circuits are likely to be encountered. gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. the charge pump requires no external components and allows operation from supplies as low as 2.7 v. power switch the power switch is a n-channel mosfet with a low on-state resistance capable of delivering 1 a of continuous current. configured as a high-side switch, the mosfet will go into high impedance when disabled. thus, preventing current flow from out to in and in to out. charge pump an internal charge pump supplies power to the circuits and provides the necessary voltage to drive the gate of the mosfet beyond the source. the charge pump is capable of operating down to a low voltage of 2.7 volts. driver the driver controls the voltage on the gate to the power mosfet switch. this is us ed to limit the large current surges when the switch is being turned on and off. proprietary circuitry controls the rise and fall time of the output voltages. enable the logic enable disables the power switch, charge pump, gate driver, logic device, and other circuitry to reduce the supply current. when the enable receives a logic high the supply current is reduced to approximately 1 a. the enable input is compatible with both ttl and cmos logic levels. over-current the over-current open drain output is asserted (active low) when an over-current condition occurs. the output will remain asserted until the over-current condition is removed. a 15 ms deglitch circuit prevents the over-current from false triggering. thermal shut-down protection when the output load exceeds the current-limit threshold or a short is present, the device limits the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (o c) logic output low. during current limit or short circuit conditions, the increasing power dissipation in the chip causing the die temperature to rise. when the die temperature reaches a certain level, the thermal sh utdown circuitry will shutdown the device. the thermal sh utdown will cycle repeatedly until the short circuit condition is resolved.
AOZ1312 rev. 1.1 july 2011 www.aosmd.com page 8 of 13 applications information input capacitor selection the input capacitor prevents large voltage transients from appearing at the input, and provides the instantaneous current needed each time the switch turns on and to limit input voltage drop. the input capacitor also prevents high-frequency noise on the power line from passing through the output of the power side. the choice of the input capacitor is based on its ripple current and voltage ratings rather than its capacitor value. the input capacitor should be located as close to the v in pin as possible. a 1 f and above ceramic cap is recommended. however, higher capacitor values further reduce the voltage drop at the input. output capacitor selection the output capacitor acts in a similar way. a small 0.1 f capacitor prevents high-frequency noise from going into the system. also, the output capacitor has to supply enough current for a large load that it may encounter during system transients. this bulk capacitor must be large enough to supply fast transient load in order to prevent the output from dropping. power dissipatio n calculation calculate the power dissipation for normal load condition using the following equation: p d = r on x (i out ) 2 the worst case power dissipation occurs when the load current hits the current limit due to over-current or short circuit faults. the power dissipation under these conditions can be calculated using the following equation: p d = (v in ? v out ) x i limit layout guidelines good pcb layout is important for improving the thermal and overall performance of the AOZ1312. to optimize the switch response time to out put short-circuit conditions keep all traces as short as po ssible to reduce the effect of unwanted parasitic inducta nce. place the input and output bypass capacitors as close as possible to the in and out pins. the input and output pcb traces should be as wide as possible for the given pcb space. use a ground plane to enh ance the power dissipation capability of the device.
AOZ1312 rev. 1.1 july 2011 www.aosmd.com page 9 of 13 package dimensions, so-8l notes: 1. all dimensions are in millimeters. 2. dimensions are inclusive of plating 3. package body sizes exclude mold flash and gate burrs. mold flash at the non-lead sides should be less than 6 mils. 4. dimension l is measured in gauge plane. 5. controlling dimension is millimeter, converted inch dimensions are not necessarily exact. symbols a a1 a2 b c d e e e1 h l dimensions in millimeters recommended land pattern min. 1.35 0.10 1.25 0.31 0.17 4.80 3.80 5.80 0.25 0.40 0 d c l h x 45 7 (4x) b 2.20 2.87 5.74 0.80 0.635 unit: mm 1.27 a1 a2 a 0.1 gauge plane seating plane 0.25 e 8 1 e e1 nom. 1.65 1.50 4.90 3.90 1.27 bsc 6.00 max. 1.75 0.25 1.65 0.51 0.25 5.00 4.00 6.20 0.50 1.27 8 symbols a a1 a2 b c d e e e1 h l dimensions in inches min. 0.053 0.004 0.049 0.012 0.007 0.189 0.150 0.228 0.010 0.016 0 nom. 0.065 0.059 0.193 0.154 0.050 bsc 0.236 max. 0.069 0.010 0.065 0.020 0.010 0.197 0.157 0.244 0.020 0.050 8
AOZ1312 rev. 1.1 july 2011 www.aosmd.com page 10 of 13 tape and reel dimensions, so-8 carrier tape reel tape size 12mm reel size ?330 m ?330.00 0.50 package so-8 (12mm) a0 6.40 0.10 b0 5.20 0.10 k0 2.10 0.10 d0 1.60 0.10 d1 1.50 0.10 e 12.00 0.10 e1 1.75 0.10 e2 5.50 0.10 p0 8.00 0.10 p1 4.00 0.10 p2 2.00 0.10 t 0.25 0.10 n ?97.00 0.10 k0 unit: mm b0 g m w1 s k h n w v r trailer tape 300mm min. or 75 empty pockets components tape orientation in pocket leader tape 500mm min. or 125 empty pockets a0 p1 p2 feeding direction p0 e2 e1 e d0 t d1 w 13.00 0.30 w1 17.40 1.00 h ?13.00 +0.50/-0.20 k 10.60 s 2.00 0.50 g r v leader/trailer and orientation unit: mm
AOZ1312 rev. 1.1 july 2011 www.aosmd.com page 11 of 13 package dimensions, msop8_ep1 gauge plane seating plane notes: 1. all dimensions are in millimeters. 2. dimensions are inclusive of plating. 3. package body sizes exclude mold flash and gate burrs. mold flash at the non-lead sides should be less than 6 mils each. 4. dimension l is measured in gauge plane. 5. controlling dimension is millimeter, converted inch dimensions are not necessarily exact. symbols a a1 a2 b c d d1 e e e1 e2 l l1 l2 1 2 dimensions in millimeters min. 0.81 0.05 0.76 0.25 0.13 2.90 1.55 2.90 4.70 1.3 0.40 0.90 0 nom. 1.02 0.86 0.30 0.15 3.00 0.65 typ. 3.00 4.90 0.55 0.95 0.25 bsc 12 max. 1.12 0.15 0.97 0.40 0.23 3.10 1.8 3.10 5.10 1.8 0.70 1.00 6 recommended land pattern d e e1 a a2 e b a1 0.10mm l2 l l1 c 1 0.75 4.35 0.65 0.35 2 e2 d1 1.9 1.9 symbols a a1 a2 b c d d1 e e e1 e2 l l1 l2 1 2 dimensions in inches min. 0.032 0.002 0.030 0.010 0.005 0.116 0.06 0.116 0.185 0.05 0.016 0.035 0 nom. 0.040 0.034 0.012 0.006 0.118 0.026 typ. 0.118 0.192 0.022 0.037 0.010 bsc 12 max. 0.044 0.006 0.038 0.016 0.010 0.120 0.07 0.120 0.20 0.07 0.028 0.039 6
AOZ1312 rev. 1.1 july 2011 www.aosmd.com page 12 of 13 tape and reel dime nsions, mso8p_ep1 carrier tape reel tape size 12mm reel size ?330 m ?330.00 0.50 package msop-8 t 0.30 0.05 b0 3.30 0.10 a0 5.20 0.10 k1 1.20 0.10 k0 1.60 0.10 d0 ?1.50 +0.1/-0.0 e 12.0 0.3 e1 1.75 0.10 e2 5.50 0.05 p0 8.00 0.10 p1 4.00 0.05 n ?97.00 0.10 unit: mm g m w1 s k h n w v r trailer tape 300mm min. components tape orientation in pocket leader tape 500mm min. k1 w 13.00 0.30 w1 17.40 1.00 h ?13.00 +0.50/-0.20 k 10.60 s 2.00 0.50 g r v leader/trailer and orientation unit: mm t r0.3 max b0 p2 p1 k0 k1 a0 p0 section b-b' section b-b' 4.2 3.4 r0.3 typ. d0 d1 e e2 e1 d1 ?1.50 min. p2 2.00 0.05 notes: 1. 10 sprocket hole pich cumulative tolerance 0.2. 2. camber not to exceed 1mm in 100mm. 3. a0 and b0 measured on a plane 0.3mm above the bottom of the pocket. 4. k0 measured from a plane on the inside bottom of the pocket to the top surface of the carrier. 5. pocket position relative to sprocket hole measured as tue position of pocket, not pocket hole. 6. all dimensions in mm. feeding direction
AOZ1312 rev. 1.1 july 2011 www.aosmd.com page 13 of 13 part marking part number code assembly lot code year code and week code fab code & assembly location code part number code assembly lot code year code and week code fab code & assembly location code AOZ1312ei-1 (msop8_ep1) AOZ1312ai-1 (so-8) as used herein: 1. life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. a critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. this datasheet contains preliminary data; supplementary data may be published at a later date. alpha & omega semiconductor reserves the right to make changes at any time without notice. life support policy alpha & omega semiconductor products ar e not authorized for use as critical components in life support devices or systems.

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